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良い値段  オンライン
ホーム > 製品 >
SMT SPI マシン
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High Precision 2D Laser Solder Paste Thicknes Inspection Machine

High Precision 2D Laser Solder Paste Thicknes Inspection Machine

ブランド名: HXT
モデル番号: SH-110-2D
MOQ: 1
価格: 1200
パッケージの詳細: Wodden箱
支払条件: T/T
詳細情報
起源の場所:
中国
証明:
CE
測定精度:
±0.001mm(±1μm)
繰り返す精度:
±0.002mm(±2μm)
基礎の寸法:
320mm×500mm×360mm
光学倍率:
25*~110*(5段階調節)
画像解像度:
600*480ピクセル
重さ:
30kg
供給の能力:
1ヶ月あたり1000
製品の説明
2D Solder Paste Thickness Inspection Machine
High Precision 2D Laser Solder Paste Thicknes Inspection Machine 0
Brief Introduction (Optimized for Buyers)

As Surface Mount Technology (SMT) advances, electronic components become increasingly smaller, packaging density becomes denser, and solder joints shrink correspondingly. Nearly 70% of PCB assembly defects are caused by improper solder paste printing.

The SH-110-2D Solder Paste Thickness Inspection Machine is designed to solve this problem. It effectively identifies potential defective solder deposits before component placement, provides accurate SPC control data (CPK, Cp), and significantly reduces defect rates.

In today's competitive electronic manufacturing environment, lower defect rates translate directly into higher profits. Strict process control requires factories to demonstrate their capability in managing solder paste printing during production. This machine provides that proof.

Beyond Solder Paste: The SH-110-2D can also be used in other production fields. Any geometric information of objects and components within 10 mm height can be precisely and non-contact measured.

Technological Parameters
Parameter Specification
Measurement Principle Non-contact laser triangulation
Measurement Accuracy ±0.001 mm (±1 µm)
Repeat Measurement Accuracy ±0.002 mm (±2 µm)
Base Dimensions (L*W*H) 320 mm * 500 mm * 360 mm
Platform Type Fixed marble platform (vibration-dampening)
Image System VGA high-definition camera
Optical Magnification 25* – 110* (5-step adjustable)
Measurement Light Source High-definition red laser
Illumination Adjustable annular LED (PC-controlled brightness)
Image Resolution 600 * 480 pixels
Software SH-110 / SPC100 (compatible with all Windows OS)
Power Supply 95–240 V AC, 50 Hz, 1000 mA
Weight 30 kg
Application Area
Category Measurable Features
Solder Paste Thickness, Area, Volume, Gap, Angle, Length, Width, Arc
Irregular Geometric Sizes Any non-standard shape within 10 mm height
PCB & Printing Ink Circuit line width, Pad height, Dimensional measurement
Electronic Components Horizontal coplanarity
Image Processing Image capture, Video processing, Documentary management
SPC Statistical Analysis CPK, Cp, and print output with full reporting
Standard Configuration (Included in Package)
Item Quantity
SH-110-2D Main Unit 1
Software Package (CD/USB) 1
Video Capture Card 1
Transmission Line 1
Video Signal Line 1
Software Encryptor (Dongle) 1
Corrective Gauges (Calibration Tool) 1
Power Cable 1
Operating Manual 1
Operating Principle (Technical Explanation for Engineers)

The non-contact thickness gauge emits a very fine laser beam at a fixed incident angle onto the measurement target. Because the target (solder paste) and its surrounding substrate (PCB surface) differ in height, the reflected sensor receives multiple laser differences.

Based on the observed data, the analysis program—using trigonometric functions—rapidly calculates and outputs precise information about the measurement target, including height, width, area, and derived volume.

良い値段  オンライン

商品の詳細

ホーム > 製品 >
SMT SPI マシン
>
High Precision 2D Laser Solder Paste Thicknes Inspection Machine

High Precision 2D Laser Solder Paste Thicknes Inspection Machine

ブランド名: HXT
モデル番号: SH-110-2D
MOQ: 1
価格: 1200
パッケージの詳細: Wodden箱
支払条件: T/T
詳細情報
起源の場所:
中国
ブランド名:
HXT
証明:
CE
モデル番号:
SH-110-2D
測定精度:
±0.001mm(±1μm)
繰り返す精度:
±0.002mm(±2μm)
基礎の寸法:
320mm×500mm×360mm
光学倍率:
25*~110*(5段階調節)
画像解像度:
600*480ピクセル
重さ:
30kg
最小注文数量:
1
価格:
1200
パッケージの詳細:
Wodden箱
受渡し時間:
30日
支払条件:
T/T
供給の能力:
1ヶ月あたり1000
製品の説明
2D Solder Paste Thickness Inspection Machine
High Precision 2D Laser Solder Paste Thicknes Inspection Machine 0
Brief Introduction (Optimized for Buyers)

As Surface Mount Technology (SMT) advances, electronic components become increasingly smaller, packaging density becomes denser, and solder joints shrink correspondingly. Nearly 70% of PCB assembly defects are caused by improper solder paste printing.

The SH-110-2D Solder Paste Thickness Inspection Machine is designed to solve this problem. It effectively identifies potential defective solder deposits before component placement, provides accurate SPC control data (CPK, Cp), and significantly reduces defect rates.

In today's competitive electronic manufacturing environment, lower defect rates translate directly into higher profits. Strict process control requires factories to demonstrate their capability in managing solder paste printing during production. This machine provides that proof.

Beyond Solder Paste: The SH-110-2D can also be used in other production fields. Any geometric information of objects and components within 10 mm height can be precisely and non-contact measured.

Technological Parameters
Parameter Specification
Measurement Principle Non-contact laser triangulation
Measurement Accuracy ±0.001 mm (±1 µm)
Repeat Measurement Accuracy ±0.002 mm (±2 µm)
Base Dimensions (L*W*H) 320 mm * 500 mm * 360 mm
Platform Type Fixed marble platform (vibration-dampening)
Image System VGA high-definition camera
Optical Magnification 25* – 110* (5-step adjustable)
Measurement Light Source High-definition red laser
Illumination Adjustable annular LED (PC-controlled brightness)
Image Resolution 600 * 480 pixels
Software SH-110 / SPC100 (compatible with all Windows OS)
Power Supply 95–240 V AC, 50 Hz, 1000 mA
Weight 30 kg
Application Area
Category Measurable Features
Solder Paste Thickness, Area, Volume, Gap, Angle, Length, Width, Arc
Irregular Geometric Sizes Any non-standard shape within 10 mm height
PCB & Printing Ink Circuit line width, Pad height, Dimensional measurement
Electronic Components Horizontal coplanarity
Image Processing Image capture, Video processing, Documentary management
SPC Statistical Analysis CPK, Cp, and print output with full reporting
Standard Configuration (Included in Package)
Item Quantity
SH-110-2D Main Unit 1
Software Package (CD/USB) 1
Video Capture Card 1
Transmission Line 1
Video Signal Line 1
Software Encryptor (Dongle) 1
Corrective Gauges (Calibration Tool) 1
Power Cable 1
Operating Manual 1
Operating Principle (Technical Explanation for Engineers)

The non-contact thickness gauge emits a very fine laser beam at a fixed incident angle onto the measurement target. Because the target (solder paste) and its surrounding substrate (PCB surface) differ in height, the reflected sensor receives multiple laser differences.

Based on the observed data, the analysis program—using trigonometric functions—rapidly calculates and outputs precise information about the measurement target, including height, width, area, and derived volume.